Liquid crystal display panel and manufacturing method thereof

ABSTRACT

A liquid crystal display panel includes a substrate, a thin film transistor array, a circuit, and a dummy circuit. One surface of the substrate is divided into a display region and a wiring region. The thin film transistor array is formed on the display region. The circuit and the dummy circuit are formed on the wiring region, the dummy circuit is adjacent to the circuit, and the circuit and the dummy circuit protrude from the substrate.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.14/031,102 filed on 19 Sep. 2013 and entitled “LIQUID CRYSTAL DISPLAYPANEL AND MANUFACTURING METHOD”, now pending.

BACKGROUND

1. Technical Field

The present disclosure relates to a liquid crystal display panel and amanufacturing method for manufacturing the liquid crystal display panel.

2. Description of Related Art

At present, many liquid crystal display panels or liquid crystal opticalassemblies include alignment films. If a substrate is covered by analignment film, a process of rubbing follows to more orderly arrange andalign the liquid crystals, such that a desirable display mode isachieved.

However, force exerted during rubbing is difficult to normalize,possibly causing thickness of the alignment film to be non-uniform. Theresult is occurrence of mura.

SUMMARY

The present disclosure provides a liquid crystal display and amanufacturing method thereof.

One embodiment of the present disclosure discloses a liquid crystaldisplay panel, which includes a substrate, a thin film transistor array,at least one circuit, and at least one supporting structure. A surfaceof the substrate is divided into a display region and a wiring regionand the wiring region is located at the outside of the display region.The thin film transistor array is formed on the display region. Thecircuit is formed on the wiring region and adjacent to one edge of thedisplay region, and the circuit is capable of transmitting signals tothe thin film transistor array. The supporting structure is formed onthe wiring region and adjacent to the circuit and the edge of thedisplay region and the supporting structure is formed in an area withoutthe circuit.

Another embodiment of the present disclosure discloses a manufacturingmethod for the liquid crystal display panel. First, a substrate with onesurface having a display region and a wiring region is provided, and thewiring region is located at the outside of the display region. Then, athin film transistor array is formed on the display region, and at leastone circuit and at least one supporting structure are formed on thewiring region. The circuit and the supporting structure are adjacent toone edge of the display region, the circuit is electrically connected tothe thin film transistor array, and the supporting structure is formedin an area without the circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the drawings are not necessarily drawn to scale, theemphasis instead being placed upon clearly illustrating the principlesof the present disclosure. Moreover, in the drawings, like referencenumerals designate corresponding parts throughout the several views, andall the views are schematic.

FIG. 1 is a plan view of a first embodiment of a liquid crystal displaypanel.

FIG. 2 is a cross-section of the liquid crystal display panel of FIG. 1,taken along line II-II thereof.

FIG. 3 is a plan view of a second embodiment of a liquid crystal displaypanel.

FIG. 4 is a cross-section of the liquid crystal display panel of FIG. 3,taken along line IV-IV thereof.

FIG. 5 is a flowchart of a manufacturing method for a liquid crystaldisplay panel.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, a first embodiment of a liquid crystaldisplay panel 100 includes a substrate 110, a thin film transistor array120, a plurality of first circuits 130, a plurality of first supportstructures 140, and an alignment film 150. In the illustratedembodiment, the first support structures 140 are dummy circuits, forexample.

A surface of the substrate 110 is divided into a display region 112 anda wiring region 113 located outside of the display region 112. In theillustrated embodiment, the display region 112 is substantiallyrectangular, and the wiring region 113 encompasses two adjacent sides ofthe display region 112. The display region 112 has a first edge 114 anda second edge 115 intersecting with the first edge 114. In theillustrated embodiment, the substrate 110 is made of glass, and thefirst edge 114 is substantially perpendicular to the second edge 115.

The thin film transistor array 120 is formed on the display region 112of the substrate 110.

The first circuits 130 and the first support structures 140 are formedon the wiring region 113 and adjacent to the first edge 114 of thedisplay region 112. The first support structures 140 are also formedadjacent to the first circuits 130. The first support structures 140 andthe first circuits 130 protrude from the substrate 110 correspondingly,and the first support structures 140 are formed in an area without thefirst circuits 130. As an example, the first circuits 130 and the firstsupport structures 140 can be arrayed in a line, with the first supportstructures 140 arrayed to fill gaps between the first circuits 130. Inthe illustrated embodiment, the first circuits 130 and the first supportstructures 140 are arrayed in a line substantially parallel to the firstedge 114 of the display region 112. Only one first circuit 130 and onlyone first support structure 140 may be provided, although any number offirst circuits 130 and the first support structures 140 may be employed.

Each first circuit 130 protruding from the substrate 110 includes afirst pattern 132, a first insulation layer 134, and a first conductionlayer 136. The first pattern 132 is formed on the wiring region 113 ofthe first substrate 110. The first insulation layer 134 is formed on thefirst pattern 132. The first conductive layer 136 is formed on the firstinsulation layer 134. The first conduction layer 136 is transparent andmade of indium tin oxide (ITO).

Each first support structure 140 protruding from the substrate 110includes a first dummy pattern 142, a first dummy insulation layer 144,and a first dummy conduction layer 146. The first dummy pattern 142 isformed on the wiring region 113 of the first substrate 110 as the firstpattern 132. The first dummy insulation layer 144 is formed on the firstdummy pattern 142. The first dummy conduction layer 146 is formed on thefirst insulation layer 144. In one embodiment, the first dummyconduction layer 146 is transparent and made of ITO. A thickness of eachfirst support structure 140 protruding from the substrate 110 issubstantially equal to a thickness of each first circuit 130 protrudingfrom the substrate 110, such that the height difference of the surfaceof the wiring region 113 adjacent to the first edge 114 of the displayregion 112 can be minimized. A rubbing process can easily direct thealignment film 150 because of the first insulation layer 134, the firstconduction layer 136, the first dummy insulation layer 144, and thefirst dummy conduction layer 146.

The first dummy patterns 142 formed between the first patterns 132 arecapable of reducing the height difference of the terrain on thesubstrate 110. In one embodiment, the thickness of each first dummypattern 142 is substantially equal to the thickness of each firstpattern 132.

The alignment film 150 exhibits excellent qualities of transparence,conduction, and heat-resistance. In the illustrated embodiment, thealignment film 150 is made of polyimide.

During fabrication of the liquid crystal display panel 100, thealignment film 150 is covered over the substrate 110 on which the firstcircuits 130 and the first support structures 140 are positioned, andrubbed in a first direction X. Since the first support structures 140are filled in gaps between the first circuits 130, force of rubbing thealignment film in the first direction X remains uniform, in addition,mura is avoided.

When there is no mura, the thicknesses of the first support structures140 protruding from the substrate 110 can be a little larger or smallerthan the thicknesses of the first circuits 130 within a flexible range.

The liquid crystal display panel 100 further includes a plurality ofother circuits 152 and other support structures 162 on a portion of thewiring region 113 adjacent to the second edge 115. The circuits 152 areconnected with and similar to the first circuit 130, and the supportstructures 162 are similar to the first support structure 140. Athickness of each circuit 152 can be substantially equal to a thicknessof each support structure 162, such that the height difference of theterrain on the wiring region 113 adjacent to the of the display region112 can be reduced. The height difference of the surface of the wiringregion 113 adjacent to the second edge 115 of the display region 112 canbe minimized.

In use, if a liquid crystal display panel of a small size requirescircuits formed adjacent to one side only, the support structures areformed adjacent to this one side correspondingly. If a large liquidcrystal display panel requires circuits formed adjacent to two or moresides, the support structures are correspondingly formed adjacent tothese sides.

In this embodiment, each first circuit 130 has an electrical connectionwith the thin film transistor array 120 in the display region 112, andeach first support structure 140 has no electrical connection with thethin film transistor array 120. The first circuits 130 are capable oftransmitting electrical signals from peripheral circuits (not shown) tothe thin film transistor array 120, such that the thin film transistorarray 120 may be controlled by the peripheral circuits.

In this embodiment, the second patterns 150 and the second dummypatterns 160 may be omitted, as may the first support structures 140 andthe second dummy patterns 160 which can be replaced by other supportstructures, such as blocks, protrusions, or other structures formed onthe substrate 110.

Referring to FIGS. 3 and 4, a second embodiment of a liquid crystaldisplay panel 200 includes a substrate 210 differing from the substrate110 of FIG. 1, in that the surface thereof is divided into a displayregion 212 and a wiring region 213. The display region 212 has a firstedge 214 and a second edge 215 intersecting the first edge 214. In theillustrated embodiment, the first edge 214 is substantiallyperpendicular to the second edge 215.

The thin film transistor array 220 is formed on the display region 212.

The first circuits 230 and the first support structures 240 have thesame structure as the first circuits 130 (referring to FIG. 1) and thefirst support structures 140, each first circuit 230 including a firstpattern, and each first support structure 240 including a first dummypattern (not shown).

The second circuits 250 and the second support structures 260 aredisposed on a portion of the wiring region 213 adjacent to the secondedge 215 and protrude from the substrate 210 correspondingly. Eachsecond circuit 250 includes a second pattern 252, a second insulationlayer 254, and a second conduction layer 256. The second pattern 252 isformed on the substrate 210, the second insulation layer 254 is formedon the second pattern 252, and the second conduction layer 256 is formedon the second insulation layer 254. The second conduction layer 256 canbe transparent and made of ITO.

Each second support structure 260 includes a second dummy pattern 262, asecond dummy insulation layer 264, and a second dummy conduction layer266. The second dummy pattern 262 is formed on the substrate 210, thesecond dummy insulation layer 264 is formed on the second dummy pattern262, and the second dummy conduction layer 266 is formed on the seconddummy insulation layer 264. The second dummy conduction layer 266 istransparent and made of ITO. A thickness of each second supportstructure 260 protruding from the substrate 210 corresponds to eachsecond circuit 250 protruding from the substrate 210. In the illustratedembodiment, the thickness of each second support structure 260 issubstantially equal to a thickness of each second circuit 250.

In the liquid crystal display panel 200, the second pattern 252 of eachsecond circuit 250 is electrically connected with the thin filmtransistor array 220 on the display region 212, and each second supportstructure 260 is not electrically connected with the thin filmtransistor array 220. The second circuits 250 are capable oftransmitting electrical signals from peripheral circuits to the thinfilm transistor array 220, such that the thin film transistor array 220may be controlled by the peripheral circuits through the second circuits250.

The height difference of the terrain on the wiring region 213 adjacentto both the first edge 214 and the second edge 215 is reduced, such thata force of rubbing in the first direction X or a second direction Y,while applying the alignment film 270 over the substrate 210, remainsuniform, whereby no mura is generated. In addition, the thicknesses ofeach second circuit 250 and each second support structure 260 aresubstantially equal to the thicknesses of each first circuit 230 andeach first support structure 240, such that force of rubbing in a thirddirection Z, while applying the alignment film 210, remains uniform.

The alignment film 270 exhibits superior transparence, conduction, andheat-resistance. In the illustrated embodiment, the alignment film 270is made of polyimide.

During fabrication of the liquid crystal display panel 200, thealignment film 270 is disposed on the substrate 210 on which the secondcircuits 250 and the second support structures 260 are positioned, andrubbed in the second direction Y. Since the second support structures260 fill in gaps between the second circuits 250, the difference heightof the terrain on the wiring region 213 adjacent to the second edge 215of the display region 210 is reduced, in addition, the rubbing forceremains stable and mura is avoided.

In the absence of mura, the thicknesses of the second support structures260 protruding from the substrate 210 can deviate from those of thesecond circuits 250 in a flexible range.

Furthermore, the thicknesses of the first and second support structures240, 260 are substantially equal to the thicknesses of the first andsecond circuits 230, 250, allowing the alignment film 270 to be rubbedin a third direction Z. Moreover, the rubbing force remains uniform andmura is reduced.

As described, the liquid crystal display panel 200 may include asubstrate 210, a thin film transistor array 220, circuits, and supportstructures. The circuits may include the first circuits 230 and/or thesecond circuits 250, but are not limited in this respect. For instant,the circuits may be formed around the thin film transistor array 220when enough space around the thin film transistor array 220 is provided.

The number of the first circuits 230, the first support structures 240,the second circuits 250, and the second support structures 260 may beany number according to the size of the substrate 210. The first supportstructures 240 and the second support structures 260 may be replaced byother support structures, such as blocks, protrusions, or otherstructures formed on the substrate 210.

FIG. 5 shows a manufacturing method of the liquid crystal display panel200. The manufacturing method includes the following steps S201, S202,S203, and S204. The steps are not limited in the illustrated order, theadjustment of the order is allowed, and some steps may be performedsimultaneously or partially simultaneously.

In step S201, a substrate 210 with a surface divided into the displayregion 212 and the wiring region 213 is provided. The wiring region 213is located outside of the display region 212.

In step S202, the thin film transistor array 220 is formed on thedisplay region 212 of the substrate 210.

In step S203, the first and second circuits 230, 250 and the first andsecond support structures 240, 260 are formed on the wiring region 213of the substrate 210, and the wiring region 213 is formed adjacent to atleast one edge of the display region 212. The first and second supportstructures 240, 260 are formed in an area without the first and secondcircuits 230, 250 adjacent to the at least one edge. The thicknesses ofeach first and each second circuit 230, 240 are formed substantiallyequal to the thicknesses of each first and each second dummy circuit250, 260. In the illustrated embodiment, the first and second circuits230, 240 and the first and second dummy circuits 250, 260 are formed inan area adjacent to two edges 214, 215 of the display region 212.

Referring to FIGS. 3 through 5, the manufacturing method can bedescribed as follows.

During manufacture of the liquid display panel 200, the substrate 210with a surface divided into the display region 212 and the wiring region213 is provided, and the wiring region 213 is located outside of thedisplay region 212. The thin film transistor array 220 is arrayed on thedisplay region 212 of the substrate 210. The first circuits 230 and thefirst support structures 240 are formed on the wiring region 213, andthe first circuits 230 are formed adjacent to the first edge 214 of thedisplay region 212 and electrically connected to the thin filmtransistor array 220. The first support structures 240 are formed in anarea without the first circuit 230 but adjacent to the first circuits230.

While forming the first circuits 230 and the first support structures240 on the wiring region 213 of the substrate 210, the first supportstructures 240 are formed to protrude from the substrate 220corresponding to the first circuits 230, and the first supportstructures 240 are formed adjacent to the first circuits 230. In oneembodiment, the thicknesses of the first support structures 240 aresubstantially equal to the thicknesses of the first circuits 230.

During formation of the first circuits 230 and the first supportstructures 240 on the wiring region 213 of the substrate 210, the firstcircuits 230 and the first support structures 240 are formed to have thesame structure as the first circuits 130 (referring to FIGS. 1 and 2)and the first support structures 140. The first patterns and the firstdummy patterns are formed on the substrate 210. The first insulationlayers are formed on the first patterns, and the first dummy insulationlayers are formed on the first dummy patterns. The first conductionlayers are formed on the first insulation layers, and the first dummyconduction layers are formed on the first dummy insulation layers. Thefirst conduction layer and the first dummy conduction layer can be madeof ITO.

The second circuits 250 and the second support structures 260 are alsoformed on the wiring region 213 of the substrate 210 during manufactureof the liquid crystal display panel 200. The second circuits 250 and thesecond support structures 260 are formed adjacent to the second edge 215of the display region 212. The first edge 214 and the second edge 215are next to each other, and the second support structures 260 are formedin an area with no second circuits 250.

During formation of the second circuits 250 and the second supportstructures 260 on the wiring region 213 of the substrate 210, the secondcircuits 250 and the second support structures 260 are formed toprotrude from the substrate 220 correspondingly, and the second supportstructures 260 are formed adjacent to the second circuits 250.

During formation of the second circuits 250 and the second supportstructures 260 on the wiring region 213 of the substrate 210, the secondpatterns 252 and the second dummy patterns 262 are first formed on thesubstrate 210. In the illustrated embodiment, the second patterns 252connect with the first patterns. In addition, the second insulationlayers 254 are formed on the second patterns 252, and the second dummyinsulation layers 264 are formed on the second dummy patterns 262. Thesecond conduction layers 256 are formed on the second insulation layers254, and the second dummy conduction layers 266 are formed on the seconddummy insulation layers 264. The second conduction layers 256 and thesecond dummy conduction layers 266 can be made of ITO.

During formation of the second circuits 250 and the second supportstructures 260 on the substrate 210, the thicknesses of the secondsupport structures 260 are formed substantially equal to the thicknessesof the second circuits 250. Furthermore, the thicknesses of the secondcircuits 250 are formed substantially equal to the thicknesses of thefirst circuits 230, and the thicknesses of the second support structures260 are formed substantially equal to the thicknesses of the firstsupport structures 240.

Furthermore, the alignment film 270 is formed on the first circuits 230and the first support structures 240, the alignment film 270 is alsoformed on the second circuits 240 and the second support structures 250.

It is believed that the present embodiments and their advantages will beunderstood from the foregoing description, and it will be apparent thatvarious changes may be made thereto without departing from the spiritand scope of the embodiments or sacrificing all of their materialadvantages.

What is claimed is:
 1. A thin film transistor substrate, comprising: asubstrate having a surface, wherein the surface has a display region anda wiring region located outside of the display region; a thin filmtransistor array formed on the display region; a plurality of firstcircuits formed on the wiring region along a first edge of the displayregion, wherein the first circuits are electrically connected andtransmit signals to the thin film transistor array; and at least onefirst dummy circuit formed alternately among the plurality of firstcircuits along the first edge of the display region on the wiringregion, wherein the first dummy circuit is electrically insulated fromthe thin film transistor array and comprises a first dummy patternformed on the substrate, a first dummy insulation layer formed on thefirst dummy pattern, and a first dummy conduction layer formed on thefirst dummy insulation layer.
 2. The substrate of claim 1, wherein amaterial of the first dummy conduction layer comprises indium tin oxide.3. The substrate of claim 1, wherein at least one of the first circuitscomprises a first pattern formed on the substrate, a first insulationlayer formed on the first pattern, and a first conduction layer formedon the first insulation layer.
 4. The substrate of claim 3, wherein amaterial of the first conduction layer comprises indium tin oxide. 5.The substrate of claim 1, wherein the first circuits and the first dummycircuit protrude from the surface of the substrate.
 6. The substrate ofclaim 5, wherein a thickness of the first circuits protruding from thesurface of the substrate is substantially equal to a thickness of thefirst dummy circuit.
 7. The substrate of claim 1, further comprising aplurality of second circuits and at least one second dummy circuitformed on the wiring region along a second edge of the display region,wherein the first edge of the display region is next to the second edgeof the display region, wherein the second circuits are electricallyconnected to the thin film transistor array.
 8. The substrate of claim7, wherein the second dummy circuit comprises a second dummy patternformed on the substrate, a second dummy insulation layer formed on thesecond dummy pattern, and a second dummy conduction layer formed on thesecond dummy insulation layer.
 9. The substrate of claim 7, wherein atleast one of the second circuit comprises a second pattern formed on thesubstrate, a second insulation layer formed on the second pattern, and asecond conduction layer formed on the second insulation layer.
 10. Thesubstrate of claim 1, wherein the first circuits and the first dummycircuits are arranged in a line.
 11. A display panel, comprising thethin film transistor substrate of claim
 1. 12. A thin film transistorsubstrate, comprising: a substrate having a surface, wherein the surfacehas a display region and a wiring region located outside of the displayregion; a thin film transistor array formed on the display region; aplurality of first circuits formed on the wiring region along a firstedge of the display region, wherein the first circuits are electricallyconnected to the thin film transistor array; and at least one firstdummy circuit formed alternately among the plurality of first circuitsalong the first edge of the display region on the wiring region, whereinthe first dummy circuit is electrically insulated from the thin filmtransistor array.
 13. The substrate of claim 12, wherein the first dummycircuit comprises a first dummy pattern formed on the substrate, a firstdummy insulation layer formed on the first dummy pattern, and a firstdummy conduction layer formed on the first dummy insulation layer. 14.The substrate of claim 12, wherein at least one of the first circuitscomprises a first pattern formed on the substrate, a first insulationlayer formed on the first pattern, and a first conduction layer formedon the first insulation layer.
 15. The substrate of claim 12, whereinthe first circuits and the first dummy circuit protrude from the surfaceof the substrate.
 16. The substrate of claim 15, wherein a thickness ofthe first circuits protruding from the surface of the substrate issubstantially equal to a thickness of the first dummy circuit.
 17. Thesubstrate of claim 12, further comprising a plurality of second circuitsand at least one second dummy circuit formed on the wiring region alonga second edge of the display region, wherein the first edge of thedisplay region is next to the second edge of the display region, whereinthe second circuits are electrically connected to the thin filmtransistor array.
 18. The substrate of claim 12, wherein the firstcircuits and the first dummy circuit are arranged in a line.
 19. Adisplay panel, comprising the thin film transistor substrate of claim12.